<p><strong>核心职责</strong></p><ul><li>制定消费电子/硬件产品技术路线与平台化架构(器件/成本/性能/交期/风险综合权衡)。</li><li>主导关键研发落地:原理设计、PCB、固件协同、调试验证、试产导入与问题闭环。</li><li>建立工程化体系:EMC/ESD/可靠性/DFM/DFT评审与设计规范,减少返工。</li><li>团队管理(技术管理:团队管理=6:4):搭流程、Review机制、拆解任务、抓交付节奏。</li><li>深度引入AI:把AI用成生产力系统(流程/模板/工具链/知识沉淀),而非浅层"会用对话工具"。</li></ul><p><strong> </strong></p><p><strong>要求</strong></p><ul><li>本科及以上:985/211/高水平理工科高校</li><li>具备至少三年的研发经验</li><li>熟悉消费电子相关技术栈:原理设计/PCB/EMC(EMI)/调试验证,理论扎实+执行经验丰富</li><li>能做前瞻规划+架构设计,并带队落地创新产品。</li></ul><p> </p><p><em>By clicking 'apply', you give your express consent that Robert Half may use your personal information to process your job application and to contact you from time to time for future employment opportunities. For further information on how Robert Half processes your personal information and how to access and correct your information, please read the Robert Half privacy notice https://www.roberthalf.cn/en/privacy-statement. Please do not submit any sensitive personal data to us in your resume (such as government ID numbers, ethnicity, gender, religion, marital status or trade union membership) as we do not collect your sensitive personal data at this time.</em></p><hr /><p><em>点击"申请",即表示您明确同意 Robert Half 可以使用您的个人信息来处理您的工作申请,并不时与您联系以获得未来的就业机会。 如需进一步了解 Robert Half 如何处理您的个人信息以及如何访问和更正您的信息,请阅读 Robert Half 隐私声明<a href="https://nam02.safelinks.protection.outlook.com/?url=https://www.roberthalf.cn/en/privacy-statement&data=05|01|
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